Dielectric substrates, metal conductors, multi-layer stackups, and loss models (FR4, Rogers, Teflon) for RF PCB simulation. TRIGGER: user asks to set up a substrate, define dielectric properties, create a stackup, select a PCB material (FR4, Rogers, Teflon, etc.), or configure metal conductors. Invo
Dielectric substrates, metal conductors, multi-layer stackups, and loss models (FR4, Rogers, Teflon) for RF PCB simulation. TRIGGER: user asks to set up a substrate, define dielectric properties, create a stackup, select a PCB material (FR4, Rogers, Teflon, etc.), or configure metal conductors. Invoke BEFORE writing dielectric() or metal() code — the API for named vs custom materials differs signi
Questa voce non pubblica alcun pacchetto npm, quindi Forge non ha un albero delle dipendenze per essa. È una lacuna di copertura, non l'affermazione che non abbia dipendenze.