Dielectric substrates, metal conductors, multi-layer stackups, and loss models (FR4, Rogers, Teflon) for RF PCB simulation. TRIGGER: user asks to set up a substrate, define dielectric properties, create a stackup, select a PCB material (FR4, Rogers, Teflon, etc.), or configure metal conductors. Invo
Dielectric substrates, metal conductors, multi-layer stackups, and loss models (FR4, Rogers, Teflon) for RF PCB simulation. TRIGGER: user asks to set up a substrate, define dielectric properties, create a stackup, select a PCB material (FR4, Rogers, Teflon, etc.), or configure metal conductors. Invoke BEFORE writing dielectric() or metal() code — the API for named vs custom materials differs signi
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